Heat transfer by conduction is involved in the use of heat sinks dissipitating heat from electronic devices. Effective transfer of heat requires using materials of high thermal conductivity. In addition, it requires appropriate values of thermal expansion, matched to the semiconductor materials, high purity of materials used and good contact between bonded elements across which heat transfer occurs. The conventional materials are not able to fulfil still raising and complex requirements. The solutions of this problem could be using the composites materials, where the combinations of different properties is possible to use. This study presents the technological tests and the analysis of correlation between processing parameters and the properties of copperaluminium nitride composites. Composite materials were obtained by mixing in planetary ball mill and then densified using the sintering under pressure or hot pressing method. The microstructure of obtained composite materials using optical microscopy and scanning electron microscopy were analyzed. Coefficient of thermal expansion (CTE) and thermal conductivity (TC) were investigated depending on the process conditions.