Paper Title:
Anti-Bacteria Behaviors of TaN-Cu and TaN-Ag Nanocomposite Thin Films
  Abstract

TaN–Cu and TaN-Ag nanocomposite films were deposited by reactive co-sputtering on Si. The films were then annealed using RTA (Rapid Thermal Annealing) at 400 °C for 2, 4, 8, 15 minutes respectively to induce the nucleation and growth of metal particles in TaN matrix and on film surface. The samples were then tested for their anti-bacterial behaviors against Gram-negative and Gram-positive bacteria. The results were compared with the solubility of Ag and Cu in a buffer solution. Under similar ion concentrations, it is concluded that Ag ion or TaN-Ag is more effective against E. Coli (Gram-negative), while Cu ion or TaN-Cu is more effective against Staphylococcus aureus (Gram-positive).

  Info
Periodical
Edited by
Pietro VINCENZINI and Ghislain MONTAVON
Pages
142-149
DOI
10.4028/www.scientific.net/AST.66.142
Citation
J. H. Hsieh, T.H. Yeh, C.S. Chiou, C.T. Huang, C. Li, "Anti-Bacteria Behaviors of TaN-Cu and TaN-Ag Nanocomposite Thin Films", Advances in Science and Technology, Vol. 66, pp. 142-149, 2010
Online since
October 2010
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