Paper Title:
Electromigration in Metal Interconnects: Electrical- and Stress Field Induced Diffusion in Small Dimensions
  Abstract

  Info
Periodical
Defect and Diffusion Forum (Volumes 129-130)
Edited by
D.L. Beke and I.A. Szabó
Pages
225-228
DOI
10.4028/www.scientific.net/DDF.129-130.225
Citation
E. E. Glickman, "Electromigration in Metal Interconnects: Electrical- and Stress Field Induced Diffusion in Small Dimensions", Defect and Diffusion Forum, Vols. 129-130, pp. 225-228, 1996
Online since
March 1996
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Price
$32.00
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