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Electromigration in Metal Interconnects: Electrical- and Stress Field Induced Diffusion in Small Dimensions

Journal Defect and Diffusion Forum (Volumes 129 - 130)
Volume Diffusion and Stresses
Edited by D.L. Beke and I.A. Szabó
Pages 225-228
DOI 10.4028/www.scientific.net/DDF.129-130.225
Citation Evgeny E. Glickman, 1996, Defect and Diffusion Forum, 129-130, 225
Authors Evgeny E. Glickman
Keywords Electromigration, Stress Induced Diffusion, Thin Film
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