CuNi-NiCr Interdiffusion by Measurement of Thin Film Electrical Resistance and Mechanical Stress |
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| Journal | Defect and Diffusion Forum (Volumes 129 - 130) |
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| Volume | Diffusion and Stresses |
| Edited by | D.L. Beke and I.A. Szabó |
| Pages | 293-294 |
| DOI | 10.4028/www.scientific.net/DDF.129-130.293 |
| Citation | W. Brückner et al., 1996, Defect and Diffusion Forum, 129-130, 293 |
| Authors | W. Brückner, H. Grieβmann |
| Keywords | Interdiffusion, Stress Measurement, Thin Film |
| Full Paper | 
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