Paper Title:
CuNi-NiCr Interdiffusion by Measurement of Thin Film Electrical Resistance and Mechanical Stress
  Abstract

  Info
Periodical
Defect and Diffusion Forum (Volumes 129-130)
Edited by
D.L. Beke and I.A. Szabó
Pages
293-294
DOI
10.4028/www.scientific.net/DDF.129-130.293
Citation
W. Brückner, H. Grieβmann, "CuNi-NiCr Interdiffusion by Measurement of Thin Film Electrical Resistance and Mechanical Stress", Defect and Diffusion Forum, Vols. 129-130, pp. 293-294, 1996
Online since
March 1996
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Price
$32.00
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