Paper Title:
Evaluation of Sputtered Tungsten as Diffusion Barrier Materials for Copper
  Abstract

  Info
Periodical
Defect and Diffusion Forum (Volumes 143-147)
Edited by
H. Mehrer, Chr. Herzig, N.A. Stolwijk, H. Bracht
Pages
1285-1290
DOI
10.4028/www.scientific.net/DDF.143-147.1285
Citation
M. Mercier, S. Weber, A. Jacques, H. Hirabayashi, H. Ohkawa, M. Kinoshita, "Evaluation of Sputtered Tungsten as Diffusion Barrier Materials for Copper", Defect and Diffusion Forum, Vols. 143-147, pp. 1285-1290, 1997
Online since
January 1997
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Price
$32.00
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