Paper Title:
The Application of the Modified Electrostatic Model to the Diffusion of 3d-Impurities in Copper
  Abstract

  Info
Periodical
Defect and Diffusion Forum (Volumes 143-147)
Edited by
H. Mehrer, Chr. Herzig, N.A. Stolwijk, H. Bracht
Pages
137-142
DOI
10.4028/www.scientific.net/DDF.143-147.137
Citation
G. Neumann, V. Tölle, A. Almazouzi, M.P. Macht, V. Naundorf, "The Application of the Modified Electrostatic Model to the Diffusion of 3d-Impurities in Copper", Defect and Diffusion Forum, Vols. 143-147, pp. 137-142, 1997
Online since
January 1997
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Price
$32.00
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