Paper Title:
Grain Boundary Diffusion and Electromigration in Cu-Sn Alloy Thin Films and their VLSI Interconnects
  Abstract

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Periodical
Defect and Diffusion Forum (Volumes 143-147)
Edited by
H. Mehrer, Chr. Herzig, N.A. Stolwijk, H. Bracht
Pages
1397-1406
DOI
10.4028/www.scientific.net/DDF.143-147.1397
Citation
D. Gupta, C. K. Hu, K.L. Lee, "Grain Boundary Diffusion and Electromigration in Cu-Sn Alloy Thin Films and their VLSI Interconnects", Defect and Diffusion Forum, Vols. 143-147, pp. 1397-1406, 1997
Online since
January 1997
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