Paper Title:
A new Insight into the Electromigration Behavior of Copper Interconnects: The Roles of Grain Boundary and Surface Diffusion
  Abstract

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Periodical
Defect and Diffusion Forum (Volumes 143-147)
Edited by
H. Mehrer, Chr. Herzig, N.A. Stolwijk, H. Bracht
Pages
1673-1678
DOI
10.4028/www.scientific.net/DDF.143-147.1673
Citation
E. E. Glickman, M. Nathan, "A new Insight into the Electromigration Behavior of Copper Interconnects: The Roles of Grain Boundary and Surface Diffusion", Defect and Diffusion Forum, Vols. 143-147, pp. 1673-1678, 1997
Online since
January 1997
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Price
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