Paper Title:
Grain Boundary Diffusion, Electromigration and Segregation in Cu and Cu-2wt% Sn Alloy
  Abstract

  Info
Periodical
Edited by
B. Bokstein and N. Balandina
Pages
161-162
DOI
10.4028/www.scientific.net/DDF.156.161
Citation
D. Gupta, "Grain Boundary Diffusion, Electromigration and Segregation in Cu and Cu-2wt% Sn Alloy", Defect and Diffusion Forum, Vol. 156, pp. 161-162, 1998
Online since
February 1998
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Price
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