Paper Title:
Copper Diffusion in Nickel Thin Film under Stresses in the Kinetic Regime 'B'
  Abstract

  Info
Periodical
Edited by
B. Bokstein and N. Balandina
Pages
181-190
DOI
10.4028/www.scientific.net/DDF.156.181
Citation
N. Balandina, B. S. Bokstein, A. Ostrovsky, "Copper Diffusion in Nickel Thin Film under Stresses in the Kinetic Regime 'B'", Defect and Diffusion Forum, Vol. 156, pp. 181-190, 1998
Online since
February 1998
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Price
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