Paper Title:
Growth and Healing of Voids at Grain Boundary during High Temperature Creep
  Abstract

  Info
Periodical
Edited by
B. Bokstein and N. Balandina
Pages
235-242
DOI
10.4028/www.scientific.net/DDF.156.235
Citation
V.S. Gostomelskii, "Growth and Healing of Voids at Grain Boundary during High Temperature Creep", Defect and Diffusion Forum, Vol. 156, pp. 235-242, 1998
Online since
February 1998
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Price
$32.00
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