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Grain Boundary Diffusion and Grain Boundary Segregation

Defect and Diffusion Forum Volume 156

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• p129 AES Study of the Mass Transport of Nickel Near Ni / Cu (111) Interface   [ 327 K ]
  Authors: Zs. Tôkei, D.L. Beke, Jean Bernardini, Andree Rolland
• p135 Grain Boundary Segregation in the Cu-Bi System   [ 559 K ]
  Authors: L.S. Chang, Eugen Rabkin, Boris B. Straumal, S. Hofmann, B. Baretzky, W. Gust
• p147 Grain Boundary Electromigration in Thin Films: Interface Reaction and Segregation Effects   [ 888 K ]
  Authors: Evgeny E. Glickman
• p161 Grain Boundary Diffusion, Electromigration and Segregation in Cu and Cu-2wt% Sn Alloy   [ 28 K ]
  Authors: D. Gupta
• p163 The Effect of Pressure on Grain Boundary Wetting, Segregation and Diffusion   [ 825 K ]
  Authors: Witold Łojkowski, Eugen Rabkin, Boris B. Straumal, Lasar S. Shvindlerman, W. Gust
• p175 Strain Induced Grain Boundary Premelting due to Heavy Pile-Up of Screw Dislocations in Deformed Copper Bicrystals   [ 442 K ]
  Authors: F. Inoko, Tatsuya Okada, Takafumi Yoshikawa
• p181 Copper Diffusion in Nickel Thin Film under Stresses in the Kinetic Regime 'B'   [ 389 K ]
  Authors: N. Balandina, Boris S. Bokstein, A. Ostrovsky
• p191 Influence of Precipitates on the Grain Boundary Diffusion: A Perturbative Approach   [ 208 K ]
  Authors: N.S. Khader, D.E. Mekki, R.J. Tarento
• p199 The Manifestations of the Diffusion-Coefficient Distribution Functions of the Grain Boundaries in W and Au Polycrystals   [ 278 K ]
  Authors: M.I. Kurkin, S.M. Klotsman, A.N. Timofeyev, V.V. Dyakin
• p205 The Study of the Diffusion of ⁵⁷Co in Polycrystalline Gold at the Upper Boundary of Temperature Interval Ordinarily Used in Intercrystallite Diffusion Investigations   [ 343 K ]
  Authors: N.I. Timofeev, S.M. Klotsman, M.I. Kurkin, V.V. Dyakin, V.K. Rudenko
• p215 Low-Temperature Interdiffusion in Binary and Multilayer Thin Film System   [ 347 K ]
  Authors: Sergey I. Sidorenko, S.M. Voloshko, M.A. Vasiliev
• p223 Exact Solution of Triple Junction Diffusion Problem   [ 149 K ]
  Authors: V.A. Ivanov, Anatoly S. Ostrovsky, A. Petelin, S. Peteline
• p229 Relaxation Processes in Ultrafine-Grained Copper Processed by Severe Plastic Deformation   [ 394 K ]
  Authors: N.M. Amirkhanov, Rinat K. Islamgaliev
• p235 Growth and Healing of Voids at Grain Boundary during High Temperature Creep   [ 310 K ]
  Authors: V.S. Gostomelskii
• p243 Mechanisms of Grain Boundary Diffusion in Intermetallic Compounds   [ 320 K ]
  Authors: Sergiy V. Divinski, Leonid N. Larikov