The Creep of Nanocrystalline Metals and its Connection with Grain Boundary Diffusion |
| Journal |
Defect and Diffusion Forum (Volumes 188 - 190) |
| Volume |
Defects and Diffusion in Metals |
| Edited by |
D.J. Fisher |
| Pages |
45-58 |
| DOI |
10.4028/www.scientific.net/DDF.188-190.45 |
| Citation |
Q.P. Kong et al., 2001, Defect and Diffusion Forum, 188-190, 45 |
| Authors |
Q.P. Kong, B. Cai, L. Lu, K. Lu |
| Keywords |
Activation Energy, Creep, Grain Boundary Diffusion, Nanocrystalline Material |
| Full Paper |
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