Paper Title:
Electromigration Kinetics in Thin Film Interconnects: Electro-Transport Coupled to Diffusional Creep
  Abstract

  Info
Periodical
Defect and Diffusion Forum (Volumes 194-199)
Edited by
Y. Limoge and J.L. Bocquet
Pages
1417-1430
DOI
10.4028/www.scientific.net/DDF.194-199.1417
Citation
E. E. Glickman, M. Nathan, "Electromigration Kinetics in Thin Film Interconnects: Electro-Transport Coupled to Diffusional Creep", Defect and Diffusion Forum, Vols. 194-199, pp. 1417-1430, 2001
Online since
April 2001
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Price
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