Paper Title:
A New Approach to Understanding Electromigration in Al(Cu) Alloys on an Atomistic Basis
  Abstract

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Periodical
Defect and Diffusion Forum (Volumes 194-199)
Edited by
Y. Limoge and J.L. Bocquet
Pages
151-156
DOI
10.4028/www.scientific.net/DDF.194-199.151
Citation
C. Schmidt, J.P. Dekker, P. Gumbsch, E. Arzt, "A New Approach to Understanding Electromigration in Al(Cu) Alloys on an Atomistic Basis", Defect and Diffusion Forum, Vols. 194-199, pp. 151-156, 2001
Online since
April 2001
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Price
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