A New Approach to Understanding Electromigration in Al(Cu) Alloys on an Atomistic Basis |
| Journal |
Defect and Diffusion Forum (Volumes 194 - 199) |
| Volume |
Diffusion in Materials DIMAT2000 |
| Edited by |
Y. Limoge and J.L. Bocquet |
| Pages |
151-156 |
| DOI |
10.4028/www.scientific.net/DDF.194-199.151 |
| Citation |
C. Schmidt et al., 2001, Defect and Diffusion Forum, 194-199, 151 |
| Authors |
C. Schmidt, J.P. Dekker, P. Gumbsch, E. Arzt |
| Keywords |
Atomistic Simulation, Electromigration, Phenomenological Equations, Solute Diffusion in Al(Cu)-Alloys |
| Full Paper |
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