Paper Title:
Diffusion Creep of Silicon during Direct Silicon Wafer Bonding
  Abstract

  Info
Periodical
Defect and Diffusion Forum (Volumes 194-199)
Edited by
Y. Limoge and J.L. Bocquet
Pages
667-672
DOI
10.4028/www.scientific.net/DDF.194-199.667
Citation
E. Belyakova, N. Shmidt, V.V. Ratnikov, A. A. Kamanin, E. D. Kim, S. C. Kim, "Diffusion Creep of Silicon during Direct Silicon Wafer Bonding", Defect and Diffusion Forum, Vols. 194-199, pp. 667-672, 2001
Online since
April 2001
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Price
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