Paper Title:
Modelling Cu Diffusion into a Ta Barrier
  Abstract

  Info
Periodical
Defect and Diffusion Forum (Volumes 200-202)
Edited by
D.J. Fisher
Pages
219-224
DOI
10.4028/www.scientific.net/DDF.200-202.219
Citation
C. L. Liu, "Modelling Cu Diffusion into a Ta Barrier", Defect and Diffusion Forum, Vols. 200-202, pp. 219-224, 2002
Online since
November 2001
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Price
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