Modelling Cu Diffusion into a Ta Barrier |
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| Journal | Defect and Diffusion Forum (Volumes 200 - 202) |
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| Volume | Defects and Diffusion in Semiconductors IV |
| Edited by | D.J. Fisher |
| Pages | 219-224 |
| DOI | 10.4028/www.scientific.net/DDF.200-202.219 |
| Citation | Chun Li Liu, 2001, Defect and Diffusion Forum, 200-202, 219 |
| Authors | Chun Li Liu |
| Keywords | Cross Diffusion, Vacancy Mechanism, Vacancy Sources |
| Full Paper | 
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