Paper Title:
Growth Kinetics of the Intermetallic Phases in the Cu/In-Bi 22at.%/Cu Interconnection
  Abstract

  Info
Periodical
Defect and Diffusion Forum (Volumes 237-240)
Edited by
M. Danielewski, R. Filipek, R. Kozubski, W. Kucza, P. Zieba, Z. Zurek
Pages
1188-1192
DOI
10.4028/www.scientific.net/DDF.237-240.1188
Citation
J. Wojewoda, P. Zięba, A. Wierzbicka, "Growth Kinetics of the Intermetallic Phases in the Cu/In-Bi 22at.%/Cu Interconnection", Defect and Diffusion Forum, Vols. 237-240, pp. 1188-1192, 2005
Online since
April 2005
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Price
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