Paper Title:
3D-Simulation of Void Formation, Growth and Migration under Electromigration
  Abstract

The 3D Monte Carlo scheme is proposed for simulation of simultaneous self-consistent current redistribution, surface diffusion, drift and void migration and coalescence at the interface metal/dielectric. Results of simulation as well as simple phenomenological model demonstrate a possibility of trapping at and migration along the grainboundaries (GBs). Critical size of “detrapping” after coalescence has been estimated.

  Info
Periodical
Defect and Diffusion Forum (Volumes 237-240)
Edited by
M. Danielewski, R. Filipek, R. Kozubski, W. Kucza, P. Zieba, Z. Zurek
Pages
1306-1311
DOI
10.4028/www.scientific.net/DDF.237-240.1306
Citation
T.V. Zaporozhets, I.V. Sobchenko, A. Gusak, "3D-Simulation of Void Formation, Growth and Migration under Electromigration", Defect and Diffusion Forum, Vols. 237-240, pp. 1306-1311, 2005
Online since
April 2005
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Price
$32.00
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