Atomic Diffusion Features in Au/Al & Al/Ni Bonding Interface |
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| Journal | Defect and Diffusion Forum (Volumes 247 - 248) |
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| Volume | Defects and Diffusion in Metals - An Annual Retrospective VIII - |
| Edited by | David J. Fisher |
| Pages | 29-0 |
| DOI | 10.4028/www.scientific.net/DDF.247-248.29 |
| Citation | Jun Hui Li et al., 2005, Defect and Diffusion Forum, 247-248, 29 |
| Online since | December, 2005 |
| Authors | Jun Hui Li, Si Zong Min, Ji An Duan, Lei Han, Jue Zhong |
| Keywords | Atomic Diffusion, Bonded Strength, Dimples, Thermosonic Bond |
| Abstract | Vertical section features in bonding point were produced by ion-sputter thinning, and were tested by using TEM-F30. Lift-off characteristics at the interface of Ultrasonic bond are observed by using SEM (JSM-6360LV). Results show that thickness of Au/Al atomic diffusion interface was about 500 Nanometer under ultrasonic and thermal energy. Ultrasonic vibration activates dislocations at metal crystal lattice. Fracture morphology of lift-off interface was dimples. Tensile fracture appeared by pull-test not in bonded interface but in basis material, and bonded strength at interface was enhanced by diffused atom from the other side. |
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