Paper Title:
Atomic Diffusion Features in Au/Al & Al/Ni Bonding Interface
  Abstract

Vertical section features in bonding point were produced by ion-sputter thinning, and were tested by using TEM-F30. Lift-off characteristics at the interface of Ultrasonic bond are observed by using SEM (JSM-6360LV). Results show that thickness of Au/Al atomic diffusion interface was about 500 Nanometer under ultrasonic and thermal energy. Ultrasonic vibration activates dislocations at metal crystal lattice. Fracture morphology of lift-off interface was dimples. Tensile fracture appeared by pull-test not in bonded interface but in basis material, and bonded strength at interface was enhanced by diffused atom from the other side.

  Info
Periodical
Defect and Diffusion Forum (Volumes 247-248)
Edited by
David J. Fisher
Pages
29-0
DOI
10.4028/www.scientific.net/DDF.247-248.29
Citation
J. H. Li, S. Z. Min, J. A. Duan, L. Han, J. Zhong, "Atomic Diffusion Features in Au/Al & Al/Ni Bonding Interface", Defect and Diffusion Forum, Vols. 247-248, pp. 29-0, 2005
Online since
December 2005
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Price
$32.00
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