Atomic Diffusion Features in Au/Al & Al/Ni Bonding Interface |
| Journal |
Defect and Diffusion Forum (Volumes 247 - 248) |
| Volume |
Defects and Diffusion in Metals - An Annual Retrospective VIII - |
| Edited by |
David J. Fisher |
| Pages |
29-0 |
| DOI |
10.4028/www.scientific.net/DDF.247-248.29 |
| Online since |
December, 2005 |
| Authors |
Jun Hui Li,
Si Zong Min,
Ji An Duan,
Lei Han,
Jue Zhong
|
| Keywords |
Atomic Diffusion, Bonded Strength, Dimples, Thermosonic Bond |
| Abstract |
Vertical section features in bonding point were produced by ion-sputter thinning, and
were tested by using TEM-F30. Lift-off characteristics at the interface of Ultrasonic bond are
observed by using SEM (JSM-6360LV). Results show that thickness of Au/Al atomic diffusion
interface was about 500 Nanometer under ultrasonic and thermal energy. Ultrasonic vibration
activates dislocations at metal crystal lattice. Fracture morphology of lift-off interface was dimples.
Tensile fracture appeared by pull-test not in bonded interface but in basis material, and bonded
strength at interface was enhanced by diffused atom from the other side. |
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