Paper Title:
Phenomenological Model for Creep Behaviour in Cu-8.5at%Al Alloy
  Abstract

Creep experiments were conducted on Cu-8.5at.% Al alloy in the intermediate temperature range from 673 to 873K, corresponding to 0.46-0.72 Tm where Tm is the absolute melting temperature. The present analysis reveals the presence of two distinct deformation regions (climb and viscous glide) in the plot of log ε vs. log σ. The implications of these results on the transition from powerlaw to exponential creep regime are examined. The results indicated that the rate controlling mechanism for creep is the obstacle-controlled dislocation glide. A phenomenological model is proposed which assumes that cell boundaries with sub-grains act as sources and obstacles to gliding dislocations.

  Info
Periodical
Defect and Diffusion Forum (Volumes 251-252)
Edited by
David J. Fisher
Pages
89-96
DOI
10.4028/www.scientific.net/DDF.251-252.89
Citation
M. Abo-Elsoud, "Phenomenological Model for Creep Behaviour in Cu-8.5at%Al Alloy", Defect and Diffusion Forum, Vols. 251-252, pp. 89-96, 2006
Online since
March 2006
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Price
$32.00
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