Isothermes of Grain Boundary Tension and Grain Boundary Adsorption in Cu-Sn System
| Periodical | Defect and Diffusion Forum (Volumes 258 - 260) |
|---|---|
| Main Theme | Diffusion in Solids and Liquids |
| Edited by | Andreas Öchsner and José Grácio |
| Pages | 427-432 |
| DOI | 10.4028/www.scientific.net/DDF.258-260.427 |
| Citation | Danil V. Vaganov et al., 2006, Defect and Diffusion Forum, 258-260, 427 |
| Online since | October, 2006 |
| Authors | Danil V. Vaganov, Sergey N. Zhevnenko |
| Keywords | Free Surface Tension, Grain Boundary Adsorption, Grain Boundary Tension, Zero Creep Method |
| Price | US$ 28,- |
Grain boundary surface tension and surface tension of free surface for pure copper and copper-tin alloys are measured. On the base of these data isothermes of grain boundary tension, free surface tension and isothermes of adsorption are constructed in assumption of a dilute solution.