Paper Title:

Isothermes of Grain Boundary Tension and Grain Boundary Adsorption in Cu-Sn System

Periodical Defect and Diffusion Forum (Volumes 258 - 260)
Main Theme Diffusion in Solids and Liquids
Edited by Andreas Öchsner and José Grácio
Pages 427-432
DOI 10.4028/www.scientific.net/DDF.258-260.427
Citation Danil V. Vaganov et al., 2006, Defect and Diffusion Forum, 258-260, 427
Online since October, 2006
Authors Danil V. Vaganov, Sergey N. Zhevnenko
Keywords Free Surface Tension, Grain Boundary Adsorption, Grain Boundary Tension, Zero Creep Method
Price US$ 28,-
Article Preview
View full size
Abstract

Grain boundary surface tension and surface tension of free surface for pure copper and copper-tin alloys are measured. On the base of these data isothermes of grain boundary tension, free surface tension and isothermes of adsorption are constructed in assumption of a dilute solution.