Grain Boundary Surface Tension, Segregation and Diffusion in Cu-Sn System |
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| Journal | Defect and Diffusion Forum (Volume 264) |
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| Volume | Diffusion and Stresses |
| Edited by | D. L. Beke, Z. Erdélyi and I. A. Szabó |
| Pages | 39-46 |
| DOI | 10.4028/www.scientific.net/DDF.264.39 |
| Citation | Evgeny I. Gershman et al., 2007, Defect and Diffusion Forum, 264, 39 |
| Online since | April, 2007 |
| Authors | Evgeny I. Gershman, Sergey N. Zhevnenko |
| Keywords | Free Surface Tension, Grain Boundary Adsorption, Grain Boundary Diffusion, Grain Boundary Tension, Zero Creep Method |
| Abstract | Grain boundary and free surface tension for pure copper and copper-tin alloys are measured. On the base of these data isothermes of grain boundary tension, free surface tension and isothermes of adsorption are constructed in assumption of a dilute solution. Grain boundary diffusion coefficients of copper were calculated by using the relation of Borisov et. al. for copper and copper-tin alloys. |
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