Paper Title:
Grain Boundary Surface Tension, Segregation and Diffusion in Cu-Sn System
  Abstract

Grain boundary and free surface tension for pure copper and copper-tin alloys are measured. On the base of these data isothermes of grain boundary tension, free surface tension and isothermes of adsorption are constructed in assumption of a dilute solution. Grain boundary diffusion coefficients of copper were calculated by using the relation of Borisov et. al. for copper and copper-tin alloys.

  Info
Periodical
Edited by
D. L. Beke, Z. Erdélyi and I. A. Szabó
Pages
39-46
DOI
10.4028/www.scientific.net/DDF.264.39
Citation
E. I. Gershman, S. N. Zhevnenko, " Grain Boundary Surface Tension, Segregation and Diffusion in Cu-Sn System ", Defect and Diffusion Forum, Vol. 264, pp. 39-46, 2007
Online since
April 2007
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$32.00
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