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Designing Cryogenic Vapour-Cooled Current Leads

Journal Defect and Diffusion Forum (Volumes 273 - 276)
Volume Diffusion in Solids and Liquids III
Edited by Andreas Öchsner and Graeme E. Murch
Pages 40-45
DOI 10.4028/www.scientific.net/DDF.273-276.40
Citation Paulo A. Augusto et al., 2008, Defect and Diffusion Forum, 273-276, 40
Online since February, 2008
Authors Paulo A. Augusto, Teresa Castelo-Grande, Domingos Barbosa, Angel M. Estévez
Keywords Design, Heat Transfer by Diffusion, Mass Transfer, Mathematical Analysis, Mathematical Procedures, Optimization Analysis, Optimization Procedure, Vapour-Cooled Current Leads
Abstract

Constructing a new device we had to design some vapour-cooled current leads. This current leads are made of Low-Tc material connected with copper wires and some parts of High-Tc material. Its design is calculated keeping in mind the heat transfer by diffusion to a vapour-cooled stream that surrounds the conductive materials. The design and the calculations performed to achieve it, and also the background theory of the heat diffusion applied in this part of the device will be described.

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