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Diffusion in Cu(Al) Solid Solution

Journal Defect and Diffusion Forum (Volume 279)
Volume Phase Transformation and Diffusion
Edited by G. B. Kale, M. Sundararaman, G. K. Dey and G. P. Tiwari
Pages 63-69
DOI 10.4028/www.scientific.net/DDF.279.63
Citation A. Laik et al., 2008, Defect and Diffusion Forum, 279, 63
Online since August, 2008
Authors A. Laik, K. Bhanumurthy, G.B. Kale
Keywords Activation Energy, Aluminium, Copper (Cu), Diffusion Coefficient, Impurity Diffusion
Abstract

The solid state diffusion characteristics in the Cu(Al) solid solution phase, was investigated in the temperature range of 1023–1223 K using single phase bulk diffusion couples between pure Cu/Cu- 10 at.% Al. The interdiffusion coefficients, D, were calculated using Boltzmann–Matano method and Hall’s method from the concentration profiles of the couples that were determined using EPMA. The interdiffusion coefficients (D) calculated ranges between 1.39 X 10−14 and 3.97 X 10−13 m2/s in the temperature range of 1023 to 1223 K. The composition and temperature dependence of D were established. The activation energy for interdiffusion varies from 123.1 to 134.2 kJ/mol in the concentration range 1 at. % ≤ CAl ≤ 9 at. %. The impurity diffusion coefficient of Al in Cu is determined by extrapolating the interdiffusion coeffficient values to infinite dilution of the alloy i.e CAl →0 and its temperature dependence was also established. The activation energy for impurity diffusion of Al in Cu was found to be 137.1 kJ/mol.

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