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Diffusion Formation of Silicide Phases in Ni/Si(001) Nanodimensional Film System

Journal Defect and Diffusion Forum (Volumes 280 - 281)
Volume Defects and Diffusion in Ceramics X
Edited by David J. Fisher
Pages 9-14
DOI 10.4028/www.scientific.net/DDF.280-281.9
Citation Sergey I. Sidorenko et al., 2008, Defect and Diffusion Forum, 280-281, 9
Online since November, 2008
Authors Sergey I. Sidorenko, Yu.N. Makogon, S.M. Voloshko, O.P. Pavlova, I.E. Kotenko, A.V. Mogilatenko, G. Beddies
Keywords Annealing, Diffusion, Inclusion, Nanodimensional Film System, Silicide
Abstract

Thermally stimulated solid state reactions in the Ni(10 nm)/Si(001) film system that occur under the annealing in the nitrogen ambient were researched by methods of сross-sectional transmission electron microscopy and scanning electron microscope. It was established that NiSi2 formation consists of several steps: a formation of the NiSi polycrystalline silicide thickness of which twice higher initial thickness of Ni layer; prevailed diffusion of Ni atoms out of NiSi into Si substrate according with lattice mechanism and appearing of exceeding vacancies at grain boundaries; a formation of epitaxial NiSi2 nuclei at separate spots of NiSi/Si(001) interface; regular growth of NiSi2 phase inclusions at the expense of NiSi layer “diffusion dissolution”; a formation of NiSi2 spherical inclusions in the lattice of Si matrix and their coalescence.

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