The Diffusion of Gallium into Copper-Tin Alloy Particles |
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| Journal | Defect and Diffusion Forum (Volumes 283 - 286) |
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| Volume | Diffusion in Solids and Liquids IV |
| Edited by | Andreas Öchsner, Graeme E. Murch and Ali Shokuhfar |
| Pages | 238-242 |
| DOI | 10.4028/www.scientific.net/DDF.283-286.238 |
| Citation | A.B. Shubin et al., 2009, Defect and Diffusion Forum, 283-286, 238 |
| Online since | March, 2009 |
| Authors | A.B. Shubin, K.Y. Shunyaev, L.F. Yamshchikov |
| Keywords | Alloy, Copper (Cu), Diffusion, Gallium, Powder, Solder, TiN |
| Abstract | Properties of diffusive-hardening pastes based on liquid gallium have been investigated. The optimal conditions were found for producing the paste (solder) with best technological characteristics. The liquid-solid ratio, powder alloy composition and dispersity, dust fractions percentage, exposition time and temperature are the main factors which determine the rheological properties of the gallium paste. |
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