Paper Title:
Grain Boundary Diffusion in Recrystallizing Nanocrystalline Materials
  Abstract

A model that considers diffusion in nanocrystalline materials undergoing recrystallization was developed. Application of this model enabled us deriving 63Ni radiotracer diffusion coefficients along the grain boundaries in ultrafine grain copper produced by equal channel angular pressing from the experimentally measured radiotracer penetration profiles.

  Info
Periodical
Defect and Diffusion Forum (Volumes 289-292)
Edited by
A. Agüero, J.M. Albella, M.P. Hierro, J. Phillibert and F.J. Pérez Trujillo
Pages
641-648
DOI
10.4028/www.scientific.net/DDF.289-292.641
Citation
L. M. Klinger, Y. Amouyal, S. V. Divinski, E. Rabkin, "Grain Boundary Diffusion in Recrystallizing Nanocrystalline Materials", Defect and Diffusion Forum, Vols. 289-292, pp. 641-648, 2009
Online since
April 2009
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