Paper Title:
Analysis of the Recrystallization of Cold-Rolled Copper after Isothermal Annealing Using Electron Backscattered Diffraction Patterns
  Abstract

Recrystallization processing of cold-rolled copper after isothermal annealing was investigated using high-resolution electron backscattered diffraction pattern analysis. The fiber texture is obtained by cold rolling with the rolled direction oriented along {111}, and the transverse and nominal directions have a random orientation. An isothermal recrystallization process at 150°C was investigated. Initially, rotations of the orientations occur from {111} to {100} and then small misfit angle boundaries decreased. Accompanying this change, the fiber-shaped grains change to a round shape grain and their sizes decrease. Considering these tendencies, we determined that rotation at subgrain boundaries is activated by isothermal annealing and subboundaries grow the boundary misfit angle >15 º. With further annealing, those grains surrounded by grain boundaries greater than 15º expanded. The rolling, transverse, and nominal orientations rotate {100}. Subsequently, a twin boundary appeared, and the fraction of twin boundaries increased.

  Info
Periodical
Defect and Diffusion Forum (Volumes 297-301)
Edited by
Andreas Öchsner, Graeme E. Murch, Ali Shokuhfar and João M.P.Q. Delgado
Pages
359-364
DOI
10.4028/www.scientific.net/DDF.297-301.359
Citation
M. Matsushita, H. Ohfuji, "Analysis of the Recrystallization of Cold-Rolled Copper after Isothermal Annealing Using Electron Backscattered Diffraction Patterns", Defect and Diffusion Forum, Vols. 297-301, pp. 359-364, 2010
Online since
April 2010
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$32.00
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