Paper Title:
Reaction Diffusion in Pb Free Solder-Cu System
  Abstract

Reaction diffusion in liquid Pb free solder- and solid Pb free solder- pure Cu systems has been investigated in the temperature range between 397 K and 563 K. The Pb free solder of which composition is 95.7 mass% Sn, 2.8 mass% Ag, 1.0 mass% Bi and 0.5 mass% Cu and 99.99 mass% oxygen free Cu has been used. In the liquid Pb free solder-pure Cu system, as soon as the solder melted down, an intermetallic compound phase formed preferentially, and grew with increasing diffusion time. Only the phase exists in the experimental time up to 120 seconds. The layer thickness of the phase obeyed the parabolic law. On the other hand, in the solid Pb free solder-pure Cu system two intermetallic compounds  phase and ’ phase form and grew with increasing diffusion time, although the  phase forms after an incubation time at low temperature. The layer thickness of these intermetallic compounds obeyed the parabolic law. The growth rate of ’ phase is greater than that of the  phase. The growth kinetics of the intermetallic compounds and the diffusion behavior in the ’ phase have been investigated.

  Info
Periodical
Defect and Diffusion Forum (Volumes 297-301)
Edited by
Andreas Öchsner, Graeme E. Murch, Ali Shokuhfar and João M.P.Q. Delgado
Pages
796-801
DOI
10.4028/www.scientific.net/DDF.297-301.796
Citation
O. Taguchi, C.G. Lee, D.Y. Park, G.S. Shin, S. Suzuki, R. Nakamura, "Reaction Diffusion in Pb Free Solder-Cu System", Defect and Diffusion Forum, Vols. 297-301, pp. 796-801, 2010
Online since
April 2010
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$32.00
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