Paper Title:
Thermal Conductivity and Thermal Expansion of Copper Matrix Composites Reinforced with High Modulus C Fibres
  Abstract

Copper matrix composite with pure copper matrix reinforced with high modulus carbon fibres Thornel K 1100 was prepared by gas pressure infiltration technique. As-received composite was subjected to thermal expansion and thermal conductivity measurements in longitudinal and transversal directions. Large anisotropy of properties as well as surprisingly good structural stability has been observed. The mean coefficients of thermal expansion as low as 0.8 x 10-6 K-1 in longitudinal and as high as 23.5 x 10-6 K-1 in transversal directions were determined, the thermal conductivities as high as 650 Wm-1K-1 in longitudinal direction and as low as 60.7 Wm-1K-1in transversal directions were measured.

  Info
Periodical
Defect and Diffusion Forum (Volumes 297-301)
Edited by
Andreas Öchsner, Graeme E. Murch, Ali Shokuhfar and João M.P.Q. Delgado
Pages
820-825
DOI
10.4028/www.scientific.net/DDF.297-301.820
Citation
N. Beronská, P. Štefánik, K. Iždinský, "Thermal Conductivity and Thermal Expansion of Copper Matrix Composites Reinforced with High Modulus C Fibres", Defect and Diffusion Forum, Vols. 297-301, pp. 820-825, 2010
Online since
April 2010
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Price
$32.00
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