Paper Title:
Diffusion Phase Formation in the Cu-Sn Nanofilms System
  Abstract

Processes involved in the structure and phase formation in the thin film systems Sn(4 nm)/Cu(14 nm) and Сu(14 nm)/Sn(8 nm) in the temperature range 130-500 оС were studied using “in situ” electron imaging and Transmission Electron Microscopy methods (TEM). Solubility of Sn α – solid solution Cu-Sn has been determined from the changes in the lattice parameter. This work was performed in the framework of the Swedish Institute supported cooperative research project “Thin metal films – the interplay of structure diffusion and boundaries” (SI dnr 00699/2009).

  Info
Periodical
Defect and Diffusion Forum (Volumes 309-310)
Edited by
B.S. Bokstein, A.O. Rodin and B.B. Straumal
Pages
167-176
DOI
10.4028/www.scientific.net/DDF.309-310.167
Citation
A. R. Rennie, S. I. Sidorenko, I.E. Kotenko, S.M. Voloshko, A. I. Oleshkevych, "Diffusion Phase Formation in the Cu-Sn Nanofilms System", Defect and Diffusion Forum, Vols. 309-310, pp. 167-176, 2011
Online since
March 2011
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$32.00
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