Paper Title:
Physical Properties of Diffusive-Hardening Alloys of Copper with Gallium and Tin
  Abstract

Gallium-based diffusive-hardening solders do not contain lead. These alloys have specific rheological properties. Their synthesis includes, as a rule, mechanical mixing of such initial components as gallium, copper and tin powders [1]. Then the metallic paste undergoes irreversible phase transformations forming a solid alloy with a specific structure. Here, we investigated microstructures of diffusive-hardened Cu-Ga-Sn alloys by SEM and EDX methods. Thermal diffusivity and heat conductivity of alloys mentioned above were studied by the laser flash method. Also differential scanning calorimetry (DSC) experiments were performed to obtain heat properties of the samples.

  Info
Periodical
Defect and Diffusion Forum (Volumes 312-315)
Edited by
Andreas Öchsner, Graeme E. Murch and João M.P.Q. Delgado
Pages
301-305
DOI
10.4028/www.scientific.net/DDF.312-315.301
Citation
A.B. Shubin, K. Y. Shunyaev, V.A. Bykov, S.I. Noritsin, "Physical Properties of Diffusive-Hardening Alloys of Copper with Gallium and Tin", Defect and Diffusion Forum, Vols. 312-315, pp. 301-305, 2011
Online since
April 2011
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