Reactive Diffusion at the Contact of a Solid Phase with the Solder Melt
| Periodical | Defect and Diffusion Forum (Volume 322) |
|---|---|
| Main Theme | Recent Advances in Mass Transport in Materials |
| Edited by | Andreas Öchsner and Graeme Murch |
| Pages | 41-72 |
| DOI | 10.4028/www.scientific.net/DDF.322.41 |
| Citation | Jaromír Drápala et al., 2012, Defect and Diffusion Forum, 322, 41 |
| Online since | March, 2012 |
| Authors | Jaromír Drápala, Petr Kubíček, Petr Harcuba, Vlastimil Vodárek, Pavel Jopek, Daniel Petlák, Gabriela Kostiuková, Kateřina Konečná |
| Keywords | Copper, Cylindrical Dissolving, Indium, Interdiffusion Coefficient, Lead-Free Solder, Melt, Planar Dissolving, Rate Constant of Dissolving, Reactive Diffusion, Silver, TiN |
| Price | US$ 28,- |
Problems of reactive diffusion at the solid phase and melt contact are studied theoretically. The rate constant is a fundamental parameter characterizing the dissolving rate at a certain configuration of experiment. Relationships between the solid phase dissolving rate, i.e. the solid phase interface boundary movement in the melt, and rates of growth of intermetallic phases in the metal (Cu) are observed. This procedure enables the creation of surface and subsurface layers of regulated thickness in metallic materials by means of reactive diffusion. The main intention was an experimental study of copper dissolving in melts of various solder alloys and the related reactive diffusion. We used Sn, SnCu, SnAgCu, SnZn and SnIn alloys as a solder material. The problems that need to be solved preferentially are emphasized. It concerns especially the determination of the rate constant of dissolving and verifying whether the proposed model equations can be used for this constant determination in cases of cylindrical and planar dissolving. Rapid growth of phases in the metal (Cu) and determination of the thickness of layers with these phases pose considerable time demands to X-ray microanalyses (WDX, EDX, BSE, SEM) of specimens after their long-time heating.
