Paper Title:
High Density Interconnect for Advanced VLSI Packaging
  Abstract

  Info
Periodical
Edited by
D. Gupta, A.D. Romig and M.A. Dayananda
Pages
129-136
DOI
10.4028/www.scientific.net/DDF.59.129
Citation
A.C. Adams, R.S. Bentson, W.J. Bertram, H.J. Levinstein, W.Q. McKnight, J. J. Rubin, B.A. ter Haar, "High Density Interconnect for Advanced VLSI Packaging", Defect and Diffusion Forum, Vol. 59, pp. 129-136, 1988
Online since
January 1991
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Price
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