High Density Interconnect for Advanced VLSI Packaging |
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| Journal | Defect and Diffusion Forum (Volume 59) |
|---|---|
| Volume | Diffusion Processes in High Technology Materials |
| Edited by | D. Gupta, A.D. Romig and M.A. Dayananda |
| Pages | 129-136 |
| DOI | 10.4028/www.scientific.net/DDF.59.129 |
| Authors | A.C. Adams, R.S. Bentson, W.J. Bertram, H.J. Levinstein, W.Q. McKnight, Jacques J. Rubin, B.A. ter Haar |
| Full Paper | 
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