Compound Formation and Interfacial Instability in the Au-Cu-Sn System at Low Temperature |
|
| Journal | Defect and Diffusion Forum (Volume 59) |
|---|---|
| Volume | Diffusion Processes in High Technology Materials |
| Edited by | D. Gupta, A.D. Romig and M.A. Dayananda |
| Pages | 271-0 |
| DOI | 10.4028/www.scientific.net/DDF.59.271 |
| Citation | J.F. Roeder et al., 1991, Defect and Diffusion Forum, 59, 271 |
| Authors | J.F. Roeder, M.R. Notis, J.I. Goldstein |
| Full Paper | 
Get the full paper by clicking here
|
First page example
