Paper Title:
Compound Formation and Interfacial Instability in the Au-Cu-Sn System at Low Temperature
  Abstract

  Info
Periodical
Edited by
D. Gupta, A.D. Romig and M.A. Dayananda
Pages
271-0
DOI
10.4028/www.scientific.net/DDF.59.271
Citation
J.F. Roeder, M.R. Notis, J.I. Goldstein, "Compound Formation and Interfacial Instability in the Au-Cu-Sn System at Low Temperature", Defect and Diffusion Forum, Vol. 59, pp. 271-0, 1988
Online since
January 1991
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Price
$32.00
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