Paper Title:
Diffusion Processes and Their Modifications in Some Pb-Sn-Cu Alloy Solders
  Abstract

  Info
Periodical
Defect and Diffusion Forum (Volumes 66-69)
Edited by
F.J. Kedves and D.L. Beke
Pages
605-624
DOI
10.4028/www.scientific.net/DDF.66-69.605
Citation
D. Gupta, J. Oberschmidt, "Diffusion Processes and Their Modifications in Some Pb-Sn-Cu Alloy Solders", Defect and Diffusion Forum, Vols. 66-69, pp. 605-624, 1990
Online since
January 1991
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Price
$32.00
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