Paper Title:
Diffusion Parameters, Grain Boundary Structure and Diffusion Mechanism in the Vicinity of the Σ 5 Coincidence Misorientation in Copper
  Abstract

  Info
Periodical
Defect and Diffusion Forum (Volumes 66-69)
Edited by
F.J. Kedves and D.L. Beke
Pages
861-868
DOI
10.4028/www.scientific.net/DDF.66-69.861
Citation
A.N. Aleshin, S.I. Prokofjev, L. S. Shvindlerman, "Diffusion Parameters, Grain Boundary Structure and Diffusion Mechanism in the Vicinity of the Σ 5 Coincidence Misorientation in Copper", Defect and Diffusion Forum, Vols. 66-69, pp. 861-868, 1990
Online since
January 1991
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.