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Effect of High Pressure on Grain Boundary Diffusion during Discontinuous Precipitation in Cu-7.5 at.% In

Journal Defect and Diffusion Forum (Volume 75)
Volume Atomic Migration and Defects in Materials
Edited by D. Gupta, H. Jain and R.W. Siegel
Pages 229-0
DOI 10.4028/www.scientific.net/DDF.75.229
Citation M. Friesel et al., 1991, Defect and Diffusion Forum, 75, 229
Authors M. Friesel, Witold Łojkowski, W. Gust, B. Predel
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