Computer Simulations and Models on Electromigration in Al-Lines of Integrated Circuits |
| Journal |
Defect and Diffusion Forum (Volumes 95 - 98) |
| Volume |
Diffusion in Materials |
| Edited by |
M. Koiwa, K. Hirano, H. Nakajima and T. Okada |
| Pages |
263-264 |
| DOI |
10.4028/www.scientific.net/DDF.95-98.263 |
| Citation |
U. Kaeber et al., 1993, Defect and Diffusion Forum, 95-98, 263 |
| Authors |
U. Kaeber, Reiner Kirchheim |
| Keywords |
Al Thin Film, Computer Simulation, Electromigration, Failure Criterion, Induced Stress |
| Full Paper |
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