Paper Title:
Grain Boundary and Bulk Diffusion in Au-Cu Thin Films
  Abstract

  Info
Periodical
Defect and Diffusion Forum (Volumes 95-98)
Edited by
M. Koiwa, K. Hirano, H. Nakajima and T. Okada
Pages
457-462
DOI
10.4028/www.scientific.net/DDF.95-98.457
Citation
A.N. Aleshin, B. S. Bokstein, V.K. Egorov, P.V. Kurkin, "Grain Boundary and Bulk Diffusion in Au-Cu Thin Films", Defect and Diffusion Forum, Vols. 95-98, pp. 457-462, 1993
Online since
January 1993
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Price
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