Paper Title:
Diffusion of Copper, Iron and Silicon in Ni3Al
  Abstract

  Info
Periodical
Defect and Diffusion Forum (Volumes 95-98)
Edited by
M. Koiwa, K. Hirano, H. Nakajima and T. Okada
Pages
859-864
DOI
10.4028/www.scientific.net/DDF.95-98.859
Citation
S. B. Jung, Y. Minamino, H. Araki, T. Yamane, K. Hirao, S. Saji, "Diffusion of Copper, Iron and Silicon in Ni3Al", Defect and Diffusion Forum, Vols. 95-98, pp. 859-864, 1993
Online since
January 1993
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.