Paper Title:
The Characterization of Electroless Ni Bump for the Flip Chip
  Abstract

  Info
Edited by
Jung-Ho Ahn and Yoo-Dong Hahn
Pages
439-444
DOI
10.4028/www.scientific.net/JMNM.15-16.439
Citation
C. Y. Lee, C. B. Lee, S. B. Jung, C.-C. Shur, "The Characterization of Electroless Ni Bump for the Flip Chip", Journal of Metastable and Nanocrystalline Materials, Vols. 15-16, pp. 439-444, 2003
Online since
April 2003
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.