Paper Title:
Lead-Free Solder System Bi5-Ag3-Cu0.5-Sn Prepared by Mechanical Alloying
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Main Theme
Edited by
Akihisa Inoue
Pages
451-454
DOI
10.4028/www.scientific.net/JMNM.24-25.451
Citation
C. Carreño-Gallardo, I. Estrada-Guel, M. Neri-Flores, R. Martínez-Sánchez, "Lead-Free Solder System Bi5-Ag3-Cu0.5-Sn Prepared by Mechanical Alloying", Journal of Metastable and Nanocrystalline Materials, Vols. 24-25, pp. 451-454, 2005
Online since
September 2005
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