Ceramic Packaging for Electronics |
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| Journal | Key Engineering Materials (Volumes 122 - 124) |
|---|---|
| Volume | Advanced Ceramic Materials |
| Edited by | Hamid Mostaghaci |
| Pages | 17-34 |
| DOI | 10.4028/www.scientific.net/KEM.122-124.17 |
| Citation | R. Roy, 1996, Key Engineering Materials, 122-124, 17 |
| Authors | R. Roy |
| Keywords | Ceramic, Electronics, Hybrid, Multilayer Packages, Packaging, Power Packages, Thick Film Hybirds |
| Full Paper | 
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