Paper Title:
Ceramic Micropackages Realised through the Technology. Specific to Electronic Components
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 132-136)
Main Theme
Edited by
P. Abelard, J. Baxter, D. Bortzmeyer et al.
Pages
1163-1166
DOI
10.4028/www.scientific.net/KEM.132-136.1163
Citation
C. Anton, V. Burghelea, I. Anton, "Ceramic Micropackages Realised through the Technology. Specific to Electronic Components", Key Engineering Materials, Vols. 132-136, pp. 1163-1166, 1997
Online since
April 1997
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Price
$32.00
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