Paper Title:
Thermal Stress Analysis of a PQFP Moulding Process: Comparison of Viscoelastic and Elastic Models
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 145-149)
Edited by
P. Tong, T.Y. Zhang and J.K. Kim
Pages
1127-1132
DOI
10.4028/www.scientific.net/KEM.145-149.1127
Citation
J. H. Park, J. K. Kim, M.M.F. Yuen, S.W.R. Lee, P. Tong, P.C.H. Chan, "Thermal Stress Analysis of a PQFP Moulding Process: Comparison of Viscoelastic and Elastic Models", Key Engineering Materials, Vols. 145-149, pp. 1127-1132, 1998
Online since
October 1997
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.