Paper Title:
Effects of Temperature Profile on the Life Prediction of PBGA Solder Joints under Thermal Cycling
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 145-149)
Edited by
P. Tong, T.Y. Zhang and J.K. Kim
Pages
1133-1138
DOI
10.4028/www.scientific.net/KEM.145-149.1133
Citation
X.W. Zhang, S.W.R. Lee, "Effects of Temperature Profile on the Life Prediction of PBGA Solder Joints under Thermal Cycling", Key Engineering Materials, Vols. 145-149, pp. 1133-1138, 1998
Online since
October 1997
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.