Paper Title:
A Method of Damage Mechanics Analysis for Solder Material
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 145-149)
Edited by
P. Tong, T.Y. Zhang and J.K. Kim
Pages
367-374
DOI
10.4028/www.scientific.net/KEM.145-149.367
Citation
H.E. Fang, C. L. Chow, F. Yang, "A Method of Damage Mechanics Analysis for Solder Material", Key Engineering Materials, Vols. 145-149, pp. 367-374, 1998
Online since
October 1997
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.