Paper Title:
Cyclic Creep Behavior of SiCw/6061Al Composites at High Temperatures
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 145-149)
Edited by
P. Tong, T.Y. Zhang and J.K. Kim
Pages
655-660
DOI
10.4028/www.scientific.net/KEM.145-149.655
Citation
P.L. Liu, Z. G. Wang, H. Toda, T. Kobayashi, "Cyclic Creep Behavior of SiCw/6061Al Composites at High Temperatures", Key Engineering Materials, Vols. 145-149, pp. 655-660, 1998
Online since
October 1997
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Price
$32.00
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